The silicon wafer is coated

  1. An oxide coated silicon wafer is patterned (circle of 30 µm diameter) using photolithography and is dipped in HF. After 2
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  2. Mask aligner is used to:I. Alignment of wafer to mask II. Coat photoresist on wafer III. Expose the coated wafer IV. Developing
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  3. the silicon wafer is coated with a layer of metallic aluminium which acts as a electric contact.
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  4. the silicon wafer is coated with a layer of metallic aluminium which acts as an electrical contact.
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  5. An oxide layer is grown on silicon wafer by dry oxidation. The layer is coated with negative photoresist. The mask is shown in
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  6. The silicon wafer is coated with a layer of metallic aluminum which acts as an electrical contact. The x-ray diffraction pattern
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  7. The silicon wafer is coated with a layer of metallic aluminum which acts as an electrical contact. The x-ray diffraction pattern
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  8. The silicon wafer is coated with a layer of metallic aluminum which acts as an electrical contact. The x-ray diffraction pattern
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  9. The silicon wafer is coated with a layer of metallic aluminum which acts as an electrical contact. The x-ray diffraction pattern
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  10. The silicon wafer is coated with a layer of metallic aluminum which acts as an electrical contact. The x-ray diffraction pattern
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