Which of the following statement is true for the lift off process?

I. After lift off process, the material is deposited at the sites which are not protected by photoresist

II. Lift off process gives a better result if the bilayer of photoresist is used instead of a single layer of photoresist
III.Lift off process is temperature dependent
IV. Quick evaporation of solvents during lift off may create a problem of redeposition
V. Deposition of material on the sidewalls creates a fence-like structure on the substrate
I, II, III, IV, V
I, III, IV, V
I, II, IV, V
I, II, III, IV