In the electroplating process, the metal key that you want to plate with copper will serve as the cathode. The cathode is where the reduction reaction occurs, meaning that copper ions in the solution will gain electrons and deposit onto the surface of the metal key.
For the anode, you can use a copper electrode. This copper anode will provide copper ions to the solution as it oxidizes during the electroplating process. The copper metal dissolves into the electrolyte solution as copper ions (Cu²⁺), which will later be reduced at the cathode (the metal key).
In summary:
- Cathode: Metal key (the object to be plated)
- Anode: Copper electrode (which provides copper ions to the solution)
Make sure to use an appropriate copper sulfate solution (CuSO₄) as the electrolyte to facilitate the electroplating process.
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